Notice of High Frequency and High Speed Polyimide Film Coverlay
Low-Loss Materials Key for High-Frequency Applications
KGK has developed a portfolio of laminate substrate materials designed to meet low-loss requirements. Laminates provide the backbone for increasingly complex circuits built on both rigid and flexible substrates. They provide mechanical integrity to flex circuits while allowing designers the freedom to fit circuits into the available footprint. All the materials in multilayer flex laminates must be chosen for their ability to combine mechanical flexibility with sufficient electrical performance
Product Features:
Excellent performance of ion migration
Low loss and high transmission materials
High reliability and excellent insulation
Excellent heat resistance and peel strength
Low Hygroscopicity
Colors |
KGK025DY | Amber |
---|---|---|
KGK025GM | Black | |
KGK025FY | Amber | |
Thickness |
KGK025DY | 37.5±10% μm |
KGK025GM | 37.5±10% μm | |
KGK025FY | 37.5±10% μm | |
Characteristics |
Resin flow | ≤0.20 mm |
Releasing force | ≤40 g/5cm | |
Peel strength | ≥1.0 kgf/cm | |
Solder resistance | 288℃ Test PASS | |
Chemical resistance | ≤20 % | |
Dielectric constant | 2.92 @15G.Hz | |
Dissipation factor | 0.007 @15G Hz | |
Shelf life | 3 months after the original producing |