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    • Ultra-thin Kapton® Polyimide Coverlay

    PI coverlay series is an insulating and heat-resistant adhesive film formed by polyimide film coated with high-performance adhesive, release paper as an isolation layer, and high-temperature curing. The material is widely used in the manufacture of FPC flexible circuit boards for circuit protection and insulation.

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    Product Features

    Excellent heat resistance and aging resistance.

    Provides a solution for slim profiles for any mobile device

    Excellent ion migration test performance

    Polyimdie Film Coverlay Series

    Yellow, black halogen-free Coverlay
    Halogen-free and phosphorus-free Coverlay
    High heat-resistant Coverlay
    Ion migration resistant Coverlay
    Black ultra-thin halogen-free PI Coverlay
    White high reflective photosensitive PI Coverlay
    Black photosensitive PI Coverlay

    Product Applications

    Small mobile devices etc.

    Coverlay for FPC:FPC manufacturing for circuit protection and insulation

    Automotive power battery protection board/CCM module/Battery module/Antenna module/LCD module/Light-Bar module

    5G communication/WPC Light-Bar module

    COF Module/Medical Instrument/TP Module/Car Module/WPC FPM Module

     

  • HOME »  Technology Information »  Ultrathin Kapton® Polyimide Tape